ATS-16D-87-C3-R0
AI

The part number **ATS-16D-87-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" attachment series designed for efficient cooling of electronic components like CPUs, GPUs, and other high-heat integrated circuits.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Thermal Resistance** | 12.96 °C/W (Unducted) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm |
| **Fin Style** | Straight (Cross-Cut) |
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### Breakdown of the Part Number
The code contains specific information about the physical and thermal properties of the unit:
1. **ATS-16**: Refers to the specific series and product family within ATS's inventory.
2. **D**: Indicates the attachment type (Push-pin style).
3. **87**: Specifies the specific dimensions and fin geometry for this model.
4. **C3**: This denotes the **Thermal Interface Material (TIM)** and the performance tier. "C3" typically means it comes pre-applied with a high-performance phase-change material or thermal grease.
5. **R0**: Refers to the revision code and packaging (standard commercial version).
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### Key Features and Applications
* **Heat Dissipation:** The cross-cut fin design increases surface area, allowing for better airflow from multiple directions.
* **Ease of Assembly:** The push-pin mechanism provides the necessary pressure for optimal thermal contact without requiring specialized tools for installation.
* **Reliability:** The aluminum body is lightweight yet durable, and the blue anodized finish provides corrosion resistance.
#### Common Uses
* **Networking Equipment:** Routers, switches, and modems.
* **Embedded Systems:** Industrial PCs and controllers.
* **Consumer Electronics:** High-end audio/video processing units.
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- ⤷What is the difference between push-pin and adhesive mounting for this heatsink?
- ⤷ How does the 'C3' thermal material compare to standard thermal paste?
- ⤷ What is the maximum TDP this heatsink can effectively cool?