The **ATS-16D-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density electronic cooling applications. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Type** | Fine Pitch (Straight Fin) | | **Thermal Resistance** | 21.97 °C/W (at 100 LFM) | | **Airflow Direction** | Vertical/Horizontal (Omnidirectional) | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) The "C2" suffix indicates that the part comes pre-applied with **ATS-PPS-02** thermal grease. This is a high-performance interface material that fills microscopic air gaps between the semiconductor (CPU/GPU/FPGA) and the heat sink base to ensure maximum heat transfer. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **ATS-16D-91-C2-R0** uses a mechanical push-pin system. This offers several advantages for electronic assemblies: * **Constant Pressure:** Ensures uniform contact with the electronic component. * **Reliability:** Resistant to vibration and shock, making it suitable for industrial or telecommunications hardware. * **Reusability:** Can be removed and reinstalled without damaging the PCB. #### C. Fin Geometry The "91" in the part number corresponds to a specific fin profile designed for **low-profile** environments. At only 10mm high, it is ideal for 1U server chassis or compact embedded systems where vertical space is limited. --- ### 3. Application Use Cases This part is typically found in the following electronic sectors: * **Networking:** Switches, routers, and high-speed modems. * **Computing:** Cooling for Northbridge/Southbridge chipsets or low-TDP processors. * **Power Electronics:** Cooling for Voltage Regulator Modules (VRMs) and Power Management ICs (PMICs).