ATS-16D-93-C2-R0
AI

The **ATS-16D-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
Below are the key physical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 40.00mm x 40.00mm |
| **Height (Fin)** | 20.00mm |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 11.91°C/W (at 100 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) |
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### 2. Design Features
The "93" in the part number refers to a specific fin pattern and density designed for optimal airflow.
* **Straight Fin Design:** This model typically utilizes a straight fin geometry which is highly effective in forced-air environments (systems with fans).
* **pushPIN™ Attachment:** Instead of using messy adhesives or fragile clips, this part uses a spring-loaded push-pin mechanism. This ensures consistent pressure across the component for better heat transfer.
* **Material Efficiency:** Made from extruded aluminum, which offers a balance between lightweight design and high thermal conductivity.
* **Blue Anodized Finish:** The coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity.
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### 3. Application Use Cases
This part is commonly found in the following electronic environments:
* **Telecommunications:** Cooling high-speed signal processors.
* **Embedded Systems:** Industrial motherboards where space is limited.
* **Power Supplies:** Managing heat in DC-DC converters.
* **Networking:** Cooling ASICs in switches and routers.
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### 4. Thermal Performance Comparison
Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 11.91 |
| 200 | 1.0 | 4.62 |
| 400 | 2.0 | 2.32 |
| 600 | 3.0 | 1.60 |
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- ⤷
What is the difference between T766 and other thermal interface materials?
- ⤷ How do I calculate the correct hole spacing for the push-pin installation?
- ⤷ Is there a copper version of this heat sink for higher thermal conductivity?