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  • ATS-16D-93-C2-R0

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    The **ATS-16D-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the key physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40.00mm x 40.00mm | | **Height (Fin)** | 20.00mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 11.91°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Design Features The "93" in the part number refers to a specific fin pattern and density designed for optimal airflow. * **Straight Fin Design:** This model typically utilizes a straight fin geometry which is highly effective in forced-air environments (systems with fans). * **pushPIN™ Attachment:** Instead of using messy adhesives or fragile clips, this part uses a spring-loaded push-pin mechanism. This ensures consistent pressure across the component for better heat transfer. * **Material Efficiency:** Made from extruded aluminum, which offers a balance between lightweight design and high thermal conductivity. * **Blue Anodized Finish:** The coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: * **Telecommunications:** Cooling high-speed signal processors. * **Embedded Systems:** Industrial motherboards where space is limited. * **Power Supplies:** Managing heat in DC-DC converters. * **Networking:** Cooling ASICs in switches and routers. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 11.91 | | 200 | 1.0 | 4.62 | | 400 | 2.0 | 2.32 | | 600 | 3.0 | 1.60 | ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between T766 and other thermal interface materials?
    • ⤷ How do I calculate the correct hole spacing for the push-pin installation?
    • ⤷ Is there a copper version of this heat sink for higher thermal conductivity?