The **ATS-16D-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for efficient cooling of semiconductor devices like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00 mm x 40.00 mm x 25.00 mm | | **Fin Style** | Straight Fin | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps identify the exact configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16**: Series identifier. * **D**: Fin pattern/density. * **95**: Specific model or size code. * **C2**: Thermal Interface Material (TIM) type (typically T766 phase-change material). * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Cooling Features #### A. Thermal Performance This heat sink is designed for forced air convection. The thermal resistance decreases significantly as airflow (LFM - Linear Feet per Minute) increases: * **@ 100 LFM:** 7.29 °C/W * **@ 500 LFM:** 1.47 °C/W #### B. PushPIN™ Attachment Instead of using messy adhesives or fragile clips, this part uses a **pushPIN™** system. This provides: 1. **Uniform Pressure:** Ensures the thermal interface material is compressed evenly for maximum heat transfer. 2. **Ease of Installation:** Pre-drilled holes in the PCB allow for quick, tool-free mounting. 3. **Reliability:** Brass components and stainless steel springs prevent the heat sink from shifting during vibration. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the part comes pre-applied with a high-performance thermal pad. This eliminates the need for manual application of thermal grease and ensures a clean, consistent contact between the component (chip) and the heat sink. --- ### 4. Applications * **Embedded Systems:** Cooling microprocessors in industrial controllers. * **Networking:** Keeping high-speed switches and routers within safe operating temperatures. * **Power Supplies:** Dissipating heat from MOSFETs and voltage regulators.