ATS-16D-96-C2-R0
AI

The **ATS-16D-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is designed to dissipate heat from surface-mount devices like CPUs, FPGAs, or power modules.
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 35.00mm |
| **Thermal Resistance** | 5.63°C/W (at 100 LFM) |
| **Airflow Pattern** | Straight Fin |
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### 2. Design Features
The component utilizes the **pushPIN™** system, which is critical for PCB-mounted electronics:
* **High-Efficiency Fin Design:** The straight-fin geometry is optimized for vertical or longitudinal airflow, providing a large surface area for heat exchange.
* **Secure Attachment:** The "Push-Pin" mechanism ensures consistent pressure (TIM - Thermal Interface Material compression) between the heat sink and the electronic component, which is vital for efficient heat transfer.
* **Material Choice:** Aluminum is used for its high thermal conductivity-to-weight ratio, ensuring the PCB is not overloaded by weight while effectively moving heat away from the silicon.
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### 3. Electronic Application
This part is typically found in the following electronic environments:
1. **Telecommunications:** Used on high-speed data processing chips.
2. **Power Electronics:** Integrated into motor drives or power supply units to cool MOSFETs or IGBTs.
3. **Embedded Systems:** Found on industrial motherboards where passive or semi-passive cooling is required for durability.
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### 4. Thermal Performance Comparison
Thermal resistance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 5.63 |
| 200 (1.0 m/s) | 3.32 |
| 400 (2.0 m/s) | 2.06 |
| 600 (3.0 m/s) | 1.62 |
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- ⤷
What are the specific hole requirements for the push-pin mounting system on a PCB?
- ⤷ How does the 'Blue Anodized' finish impact the thermal performance compared to raw aluminum?
- ⤷ Is this heat sink compatible with pre-applied Thermal Interface Materials (TIM)?