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  • ATS-16D-96-C2-R0

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    The **ATS-16D-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is designed to dissipate heat from surface-mount devices like CPUs, FPGAs, or power modules. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 35.00mm | | **Thermal Resistance** | 5.63°C/W (at 100 LFM) | | **Airflow Pattern** | Straight Fin | --- ### 2. Design Features The component utilizes the **pushPIN™** system, which is critical for PCB-mounted electronics: * **High-Efficiency Fin Design:** The straight-fin geometry is optimized for vertical or longitudinal airflow, providing a large surface area for heat exchange. * **Secure Attachment:** The "Push-Pin" mechanism ensures consistent pressure (TIM - Thermal Interface Material compression) between the heat sink and the electronic component, which is vital for efficient heat transfer. * **Material Choice:** Aluminum is used for its high thermal conductivity-to-weight ratio, ensuring the PCB is not overloaded by weight while effectively moving heat away from the silicon. --- ### 3. Electronic Application This part is typically found in the following electronic environments: 1. **Telecommunications:** Used on high-speed data processing chips. 2. **Power Electronics:** Integrated into motor drives or power supply units to cool MOSFETs or IGBTs. 3. **Embedded Systems:** Found on industrial motherboards where passive or semi-passive cooling is required for durability. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.63 | | 200 (1.0 m/s) | 3.32 | | 400 (2.0 m/s) | 2.06 | | 600 (3.0 m/s) | 1.62 | ---
    ✨ Follow-up Questions
    • ⤷ What are the specific hole requirements for the push-pin mounting system on a PCB?
    • ⤷ How does the 'Blue Anodized' finish impact the thermal performance compared to raw aluminum?
    • ⤷ Is this heat sink compatible with pre-applied Thermal Interface Materials (TIM)?