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  • ATS-16E-06-C2-R0

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    ## Analysis of ATS-16E-06-C2-R0 The **ATS-16E-06-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed for efficient thermal management in electronic assemblies. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | pushPIN™ (Push Pins & Springs) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 20.30 °C/W (undirected flow) to 1.30 °C/W (at 800 LFM) | | **Base Dimensions** | 45.00 mm x 45.00 mm | | **Height (Fin)** | 10.00 mm | | **Pitch/Pattern** | Fine Pitch (COARSE-PITCH style) | --- ### Key Components & Features #### 1. Thermal Performance This heat sink is designed for optimal air flow. The thermal resistance varies significantly based on the Air Velocity (Measured in Linear Feet per Minute - LFM): * **Low Flow (200 LFM):** ~5.40 °C/W * **High Flow (800 LFM):** ~1.30 °C/W This indicates that the part is highly dependent on active cooling (fans) for maximum efficiency. #### 2. The pushPIN™ Attachment System The "R0" at the end of the part number signifies the specific attachment kit. * **Mechanism:** Uses a brass or plastic push pin and a stainless steel compression spring. * **Benefit:** Provides a precise, uniform pressure (Pre-assembled) against the component (CPU/GPU/FPGA) to ensure optimal heat transfer. * **Hole Pattern:** Usually designed for industry-standard PCB hole layouts. #### 3. Material and Coating * **Aluminum Construction:** Offers a balance between weight, cost, and thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative cooling. #### 4. Thermal Interface Material (TIM) Typically, ATS units in this series come with **T766** pre-applied thermal grease or similar, which fills the microscopic air gaps between the heat sink base and the electronic component. --- ### Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **16E** | Series and specific fin geometry | | **06** | Product dimension/ID code | | **C2** | Thermal Performance Class / Material code | | **R0** | Packaging and Attachment specific identifier | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for this pushPIN heat sink?
    • ⤷ Can this heat sink be used for passive cooling without a fan?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?