ATS-16E-06-C2-R0
AI

## Analysis of ATS-16E-06-C2-R0
The **ATS-16E-06-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed for efficient thermal management in electronic assemblies.
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### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | pushPIN™ (Push Pins & Springs) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 20.30 °C/W (undirected flow) to 1.30 °C/W (at 800 LFM) |
| **Base Dimensions** | 45.00 mm x 45.00 mm |
| **Height (Fin)** | 10.00 mm |
| **Pitch/Pattern** | Fine Pitch (COARSE-PITCH style) |
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### Key Components & Features
#### 1. Thermal Performance
This heat sink is designed for optimal air flow. The thermal resistance varies significantly based on the Air Velocity (Measured in Linear Feet per Minute - LFM):
* **Low Flow (200 LFM):** ~5.40 °C/W
* **High Flow (800 LFM):** ~1.30 °C/W
This indicates that the part is highly dependent on active cooling (fans) for maximum efficiency.
#### 2. The pushPIN™ Attachment System
The "R0" at the end of the part number signifies the specific attachment kit.
* **Mechanism:** Uses a brass or plastic push pin and a stainless steel compression spring.
* **Benefit:** Provides a precise, uniform pressure (Pre-assembled) against the component (CPU/GPU/FPGA) to ensure optimal heat transfer.
* **Hole Pattern:** Usually designed for industry-standard PCB hole layouts.
#### 3. Material and Coating
* **Aluminum Construction:** Offers a balance between weight, cost, and thermal conductivity.
* **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of corrosion resistance and slightly improves radiative cooling.
#### 4. Thermal Interface Material (TIM)
Typically, ATS units in this series come with **T766** pre-applied thermal grease or similar, which fills the microscopic air gaps between the heat sink base and the electronic component.
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### Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **16E** | Series and specific fin geometry |
| **06** | Product dimension/ID code |
| **C2** | Thermal Performance Class / Material code |
| **R0** | Packaging and Attachment specific identifier |
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- ⤷
What are the PCB hole diameter requirements for this pushPIN heat sink?
- ⤷ Can this heat sink be used for passive cooling without a fan?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?