The **ATS-16E-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of integrated circuits (ICs) and other PCB components. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 17.00°C/W (Unducted @ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | --- ## 2. Key Design Components ### A. Material and Finish * **Aluminum Construction:** Offers a high thermal conductivity-to-weight ratio, ensuring efficient heat transfer from the component to the ambient air. * **Blue Anodized Coating:** Provides corrosion resistance and increases emissivity, which improves radiative heat transfer. ### B. Thermal Performance The heat sink is designed for high-efficiency air cooling. Its performance varies based on the Air Flow (LFM): * **Unducted Flow:** 17.00°C/W at 100 LFM. * **Ducted Flow:** Performance improves significantly (down to 2.46°C/W at 700 LFM) as air is forced through the fin structure. ### C. Mounting Mechanism (pushPIN™) This part utilizes a specific attachment system consisting of: 1. **Brass Pins:** Inserted through pre-drilled holes in the PCB. 2. **Compression Springs:** Apply consistent pressure to ensure a tight thermal interface between the heat sink and the chip. 3. **Flexible Attachment:** Allows for easy installation and removal without the risk of adhesive mess. --- ## 3. Product Nomenclature Breakdown | Code Segment | Meaning | | :--- | :--- | | **ATS-16** | Series identifier | | **E** | Finish/Color (Blue Anodized) | | **07** | Internal sizing/revision code | | **C2** | Thermal Interface Material (Pre-applied T766) | | **R0** | RoHS compliant / Revision status | --- ## 4. Common Applications * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Networking:** Cooling ASICs in switches and routers. * **Embedded Systems:** Protecting CPUs/Microcontrollers from thermal throttling.