The **ATS-16E-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICECUBE" series, designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table summarizes the core technical attributes of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-142 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (2-Pin) | | **Thermal Resistance** | 4.72°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Pattern** | Square Fin | --- ### 2. Electronic/Physical Features The part is engineered to manage heat dissipation in high-density electronic environments. Key electronic-related features include: * **Push-Pin Attachment:** The `-R0` suffix indicates a push-pin mounting mechanism with a brass tip. This ensures constant pressure on the semiconductor, improving the efficiency of the Thermal Interface Material (TIM). * **Thermal Performance:** It is designed for **forced air** environments. Its thermal resistance varies significantly based on airflow: * **200 LFM (Linear Feet per Minute):** 4.72°C/W * **500 LFM:** 2.90°C/W * **Pre-Applied TIM:** These units typically come with **ATS-53** thermal interface material pre-applied to the base to simplify assembly and ensure optimal heat transfer from the chip to the aluminum fins. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer Prefix | | **16E** | Series Identifier (Push-Pin type) | | **142** | Specific Dimension/Fin Configuration | | **C2** | Material/Finish Code (Blue Anodized Aluminum) | | **R0** | Revision/Packaging status | --- ### 4. Applications This heat sink is commonly found in: 1. **Network Switches/Routers:** Cooling ASICs and FPGAs. 2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs.