## Technical Overview: ATS-16E-35-C2-R0 The **ATS-16E-35-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for efficient thermal management of electronic components such as CPUs, GPUs, and power transistors. --- ### 1. Part Number Breakdown The nomenclature provides specific details about the physical and thermal properties: | Segment | Meaning | Value | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **16E** | Push Pin Type | 16mm or specific series designation | | **35** | Height | 35mm (approximate fin height) | | **C2** | Thermal Interface | T766 Phase Change Material (High performance) | | **R0** | Revision / Finish | Standard Blue Anodized Finish | --- ### 2. Physical Specifications This heat sink utilizes a **cross-cut** or **straight fin** design to maximize surface area and improve airflow efficiency. * **Material:** Aluminum (AL6063) for optimal thermal conductivity and low weight. * **Dimensions:** 35mm x 35mm base (standard square footprint). * **Mounting Type:** Push-Pin (Easy assembly using pre-drilled holes in the PCB). * **Fin Style:** High-density fins for improved heat dissipation. --- ### 3. Thermal Performance The efficiency of the ATS-16E-35-C2-R0 is measured by its thermal resistance (lower is better). The performance varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM (0.5 m/s) | ~2.5 to 3.5 | | 400 LFM (2.0 m/s) | ~1.5 to 2.0 | | 700 LFM (3.5 m/s) | ~1.0 to 1.5 | --- ### 4. Key Electronic Applications This component is used in electronic systems to prevent thermal throttling and hardware failure: 1. **Field Programmable Gate Arrays (FPGAs):** Managing heat in high-speed logic circuits. 2. **Power Converters:** Dissipating heat from MOSFETs and voltage regulators. 3. **Embedded Systems:** Cooling processors in industrial computers where space is limited but high airflow is present. --- ### 5. Mounting Mechanism (pushPIN™) The "pushPIN™" system is a key feature of this part: * **Spring-loaded:** Ensures consistent pressure between the heat sink and the chip. * **Tool-less:** Often allows for quick installation compared to screw-mount options. * **Compatibility:** Designed for standard PCB hole patterns (typically 43mm or 47mm spacing depending on the specific pin).