The **ATS-16E-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-16E-52-C2-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 10.79°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Fin Style** | Straight Fin | --- ### 2. Physical Design & Construction * **Dimensions:** It features a footprint of **30x30mm** with a height of **25mm**. This "tall" profile provides a larger surface area for heat dissipation in vertical spaces. * **Material:** It is made of high-grade aluminum. The **Blue Anodized** finish is not just for aesthetics; it increases surface emissivity and provides corrosion resistance. * **Fin Pattern:** The straight fin design is optimized for unidirectional airflow. --- ### 3. Mounting Mechanism (Push-Pin) This specific model uses a **Push-Pin and Compression Spring** system: * **Reliability:** The spring provides a precise, uniform pressure across the component (TIM - Thermal Interface Material), ensuring better heat transfer. * **Ease of Assembly:** It allows for quick installation on pre-drilled holes in the PCB. * **Hardware:** It typically uses a brass or plastic push-pin with a stainless steel spring for durability. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 10.79 | | 300 | 1.5 | 3.64 | | 500 | 2.5 | 2.53 | | 700 | 3.5 | 2.13 | --- ### 5. Common Applications * **BGA Cooling:** Ideal for Ball Grid Array chips like FPGAs, processors, or ASICs. * **Embedded Systems:** Used in networking gear and industrial PCs where airflow is controlled. * **Power Electronics:** Cooling MOSFETs or voltage regulators that generate concentrated heat.