The **ATS-16E-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for high-performance cooling of electronic components such as processors, FPGAs, and GPUs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing Air)** | 1.97 °C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 5.31 °C/W | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **TIM (Thermal Interface Material)** | T412 (High performance) | --- ### 2. Key Components & Design The ATS-16E-75-C3-R0 is engineered with three primary electronic/mechanical parts: * **Heat Sink Body:** Utilizes a spread-fin pattern that increases surface area while reducing pressure drop. The "maxiFLOW" geometry allows air to flow through the fins from multiple directions. * **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a plastic or brass pin and a stainless steel spring. This provides a precise "preload" (downward force) to ensure optimal contact with the electronic chip. * **T412 Thermal Interface Material (TIM):** Pre-applied to the base of the heat sink. This is a specialized material that fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ### 3. Application Use Cases This part is typically used in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking switches. 2. **Embedded Systems:** For industrial computers where space is limited but heat density is high. 3. **Power Supplies:** Cooling MOSFETs or power conversion modules. ---