## Technical Overview of ATS-16E-79-C2-R0 The **ATS-16E-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "pushPIN™" series, designed for cooling electronic integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Key Technical Specifications Below are the primary physical and thermal parameters of this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.63 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 10mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Flow Direction** | COARSE-PITCH (Vertical Fins) | | **Spring/Fastener** | ATS-PP-05 | --- ### 2. Design and Components The "Electronic Parts" of this assembly include the heat sink body and its mechanical mounting system: #### A. The Heat Sink Body * **Material:** Made from **6063 Aluminum**, which offers a balance of high thermal conductivity and structural strength. * **Fin Design:** It uses a **Coarse-Pitch** fin geometry. This is optimized for systems with lower airflow or where the air path may be slightly obstructed, allowing air to pass through the fins with less pressure drop. * **Thermal Interface Material (TIM):** This part typically comes pre-applied with a high-performance phase-change material to ensure a low-resistance thermal path between the chip and the aluminum base. #### B. The pushPIN™ Mounting System Instead of using adhesive tape (which can fail under high heat), this part uses a mechanical fastening system: * **Push Pins:** Plastic or brass pins that lock into pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** Stainless steel springs provide precise downward pressure (approx. 20 PSI) to ensure maximum contact between the heat sink and the electronic component. --- ### 3. Thermal Performance Data Thermal performance varies based on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 2.63 °C/W | 1.58 °C/W | 1.30 °C/W | | **Thermal Resistance (Ducted)** | 1.78 °C/W | 1.25 °C/W | 1.09 °C/W | --- ### 4. Part Number Breakdown Understanding the ATS nomenclature: * **ATS-16**: Series number. * **E**: Fin Pitch (Coarse). * **79**: Specific dimensions/design iteration. * **C2**: Material/Color code (Blue Anodized). * **R0**: RoHS compliance status.