The part number **ATS-16E-83-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, known for its standardized mounting system. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 1.60 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Fin Type** | Straight Fin | | **Number of Fins** | 8 | --- ### 2. Design and Components This part is composed of three primary electronic cooling elements: * **Heatsink Body:** A square 30mm aluminum block with vertical fins. The high height-to-width ratio (30mm height) provides a large surface area for heat dissipation in vertical airflow environments. * **Push Pins:** These are the mechanical fasteners. They are typically made of brass or plastic with a stainless steel spring to provide consistent pressure (loading) on the heat-generating component. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal pad or grease on the base to ensure efficient heat transfer from the chip to the aluminum. --- ### 3. Thermal Performance Matrix Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 1.60 | 0.97 | 0.82 | 0.73 | 0.67 | --- ### 4. Key Applications * **High-Density Electronics:** Used in networking equipment and servers where space is limited but heat generation is high. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Embedded Systems:** Ideal for industrial PCs and automation controllers.