The **ATS-16F-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *pushPIN™* series, designed for efficient cooling of integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is a breakdown of its core specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 21.05 °C/W (Unducted @ 100 LFM) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 10.00 mm | | **Thermal Interface (TIM)** | T412 (Pre-applied) | --- ### 2. Component Design Details #### A. Fin Pattern (Straight Fin) The "01" in the part number indicates a **straight-fin** design. This pattern is ideal for "ducted" airflow environments where air is forced directly through the channels between the fins, providing a predictable cooling path. #### B. pushPIN™ Attachment System Unlike adhesive tapes that can fail over time or standard screws that might apply uneven pressure, the pushPIN™ system uses: * **Brass or Plastic Pins:** To secure the sink to the PCB. * **Compression Springs:** To provide precise, uniform pressure (load) on the component being cooled, ensuring maximum heat transfer. #### C. Thermal Interface Material (TIM) This model comes with **T412** thermal grease pre-applied to the base. T412 is a high-efficiency interface material that fills microscopic air gaps between the component die and the heat sink base, significantly reducing thermal impedance. --- ### 3. Performance Matrix Thermal resistance depends heavily on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity | 100 LFM (0.5 m/s) | 300 LFM (1.5 m/s) | 500 LFM (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 21.05 °C/W | 6.02 °C/W | 3.62 °C/W | --- ### 4. Summary of Use The **ATS-16F-01-C3-R0** is best suited for low-profile applications where vertical space is limited (10mm height) but significant surface area (40x40mm) is required. It is commonly found in networking switches, industrial controllers, and telecommunications equipment.