The **ATS-16F-05-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to maximize cooling efficiency in constrained airflows. --- ### 1. Technical Specifications The part is defined by its geometry, thermal resistance, and material composition. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-16F-05-C3-R0 | | **Component Category** | Thermal Management / Heat Sink | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 0.60°C/W (at 200 LFM) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and clearance. | Dimension | Value (mm) | | :--- | :--- | | **Length (A)** | 40.00 mm | | **Width (B)** | 46.50 mm | | **Height (C)** | 25.00 mm | | **Pitch (E)** | 45.00 mm | | **Pitch (F)** | 20.00 mm | --- ### 3. Key Electronic/Thermal Characteristics * **maxiFLOW™ Geometry:** The design features a spread-fin pattern that increases the surface area while reducing pressure drop. This is particularly effective in systems with directional airflow. * **pushPIN™ Attachment:** This system uses a flexible, tool-free mounting mechanism that provides a consistent pressure on the electronic component (like a CPU, FPGA, or GPU), ensuring optimal thermal interface material (TIM) performance. * **Thermal Performance:** With a thermal resistance of 0.60°C/W at 200 LFM (Linear Feet per Minute), it is capable of dissipating significant heat from high-performance semiconductors. * **Material Properties:** Made of high-grade aluminum, it offers a balance between lightweight construction and high thermal conductivity. The **Blue Anodized** finish provides corrosion resistance and increased emissivity. --- ### 4. Typical Applications * **High-speed Networking:** Switches and routers where airflow is managed. * **Industrial Power Supplies:** Cooling power MOSFETs or IGBTs. * **Computing:** Secondary cooling for chipsets or high-speed memory controllers.