The **ATS-16F-06-C3-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It belongs to the **blueICE™** series, designed for cooling electronic components like BGA (Ball Grid Array) packages. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-16F-06-C3-R0 | | **Heat Sink Type** | Push-Pin (BGA Mount) | | **Dimensions** | 40mm x 40mm x 25mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Thermal Resistance** | 16.30°C/W (Natural Convection) | --- ### 2. Key Components & Design Features #### A. Fin Design (Straight Fin) The "F" in the part number denotes a **Straight Fin** geometry. This design is optimized for environments with consistent airflow, allowing air to pass through the channels efficiently to dissipate heat from the base. #### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, this model uses a **brass push-pin** system with a **stainless steel compression spring**. * **Security:** Provides a firm, reliable attachment to the PCB. * **Pressure:** Ensures uniform pressure across the component interface for maximum thermal transfer. * **Ease of Install:** Can be installed via pre-drilled holes in the motherboard. #### C. Phase Change Material (Thermal Interface) The "R0" suffix typically indicates the inclusion of a **Thermal Interface Material (TIM)**. In this specific series, it usually features **Saint-Gobain C675** or a similar high-performance phase-change material pre-applied to the base, eliminating the need for separate thermal paste. --- ### 3. Application Use Cases This part is commonly found in industrial and networking hardware, including: * **CPUs/GPUs:** Cooling secondary processors or embedded controllers. * **ASICs & FPGAs:** Used in telecommunications equipment. * **Power Supplies:** Heat dissipation for high-load power transistors. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 5.30 | | 400 (2.0 m/s) | 3.10 | | 600 (3.0 m/s) | 2.50 |