The **ATS-16F-07-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **push-pin heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or FPGAs, within electronic assemblies. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Thermal Resistance** | 17.09 °C/W (at 100 LFM) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Detailed Component Breakdown #### A. The Heat Sink (Thermal Conductor) The main body is made of **Blue Anodized Aluminum**. Aluminum is used for its high thermal conductivity and lightweight nature. The "Straight Fin" design allows for efficient airflow, making it ideal for systems with forced convection (fans). #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-16F-07-C3-R0** uses a mechanical push-pin system. * **Hole Pattern:** Requires pre-drilled holes in the PCB. * **Compression Spring:** Provides consistent downward pressure on the electronic component to ensure maximum contact. * **Material:** The pins are typically made of durable plastic (polyamide). #### C. Thermal Interface Material (TIM) The part comes with **T412** pre-applied to the base. * **Function:** It fills microscopic air gaps between the chip surface and the heat sink. * **Benefit:** Reduces thermal resistance and eliminates the need for manual thermal paste application during assembly. --- ### 3. Application Use Cases * **Embedded Systems:** Cooling processors in industrial computers. * **Networking:** Keeping high-speed switches or routers within safe operating temperatures. * **Power Electronics:** Managing heat for voltage regulators or power modules.