The **ATS-16F-10-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed for high-efficiency cooling in restricted spaces. --- ### ## Technical Specifications Below are the primary technical parameters for this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16F-10-C2-R0 | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 7.89°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height (Fin Depth)** | 25.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ## Key Electronic & Mechanical Features #### 1. pushPIN™ Attachment System This part uses a specialized attachment mechanism rather than simple adhesive. * **Performance:** It provides precise pressure to optimize thermal transfer from the electronic component (CPU/GPU/FPGA) to the heat sink. * **Hardware:** It typically consists of a brass or plastic pin with a stainless steel spring to maintain consistent contact force. #### 2. maxiFLOW™ Fin Design The "F" in the part number signifies the maxiFLOW™ geometry. * **Aerodynamics:** The fins are tapered and spread out to maximize surface area while minimizing pressure drop. * **Flow:** Designed specifically for forced-air cooling environments where airflow direction is consistent. #### 3. Thermal Interface Material (T766) The part comes with **T766** pre-applied to the base. * **Purpose:** It fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance at the contact point. #### 4. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized:** The finish is not just aesthetic; anodizing protects the aluminum from corrosion and slightly increases surface emissivity, aiding in heat radiation. --- ### ## Application Use Cases This component is generally used to cool high-heat dissipation surface-mount devices (SMD) such as: * Network Switches and Routers. * Advanced Power Supplies. * High-speed microprocessors or FPGAs. * Telecommunications equipment.