The **ATS-16F-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Fin)** | 25mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 4.84°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Components & Features 1. **High-Performance Fin Design:** The "F" in the part number indicates a **Fine-Pitch** fin pattern. This increases the surface area available for heat dissipation, making it ideal for high-speed airflow environments. 2. **pushPIN™ Attachment:** The part uses a specialized attachment mechanism consisting of a brass or plastic pin and a compression spring. This ensures: * Consistent pressure on the chip for optimal thermal contact. * Secure mounting that resists vibration. * Quick and easy installation. 3. **Advanced Thermal Interface Material (T766):** The base comes with pre-applied T766 phase-change material. This fills microscopic air gaps between the heat source and the heat sink, significantly reducing thermal impedance. 4. **Blue Anodized Finish:** Beyond aesthetics, the anodized coating increases emissivity and protects the aluminum from corrosion. --- ### Thermal Performance Data (Airflow) Performance varies based on the linear feet per minute (LFM) of airflow provided by system fans: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.84 | | 300 (1.5 m/s) | 1.87 | | 500 (2.5 m/s) | 1.35 | | 700 (3.5 m/s) | 1.11 | --- ### Application Use Cases * **BGA Cooling:** Ideal for Ball Grid Array processors. * **Networking Equipment:** Used in routers and switches. * **Industrial PCs:** Suitable for embedded systems requiring high reliability.