ATS-16F-101-C3-R0
AI

The **ATS-16F-101-C3-R0** is a high-performance electronic component belonging to the **Heat Sink** category. It is specifically part of the **Advanced Thermal Solutions (ATS)** "maxiFLOW" product line, designed to dissipate heat from integrated circuits (ICs) like CPUs, FPGAs, or GPUs.
---
### 1. Technical Specifications
Below are the key electronic and physical parameters for this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Part Number** | ATS-16F-101-C3-R0 |
| **Thermal Resistance** | 6.77°C/W (at 200 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm |
| **Flow Pattern** | Straight Fin |
---
### 2. Electronic Packaging & Thermal Management
Heat sinks like the ATS-16F-101-C3-R0 are critical for maintaining the reliability of electronic systems.
* **Thermal Performance:** The "C3" designation indicates a specific thermal performance profile. It is designed to lower the junction temperature of a semiconductor, preventing **thermal throttling** or permanent damage.
* **Material Science:** The Blue Anodized finish isn't just aesthetic; it increases the emissivity of the surface, slightly improving heat radiation and protecting the aluminum from oxidation.
* **pushPIN™ Attachment:** This specific model uses a spring-loaded pin mechanism. This is preferred in high-vibration environments (like industrial servers) over adhesive tapes because it provides consistent downward pressure on the processor, ensuring a better thermal interface.
---
### 3. Application Use Cases
This component is typically found in the following electronic assemblies:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Cooling for high-density power modules.
---
### 4. Part Number Breakdown
* **ATS:** Advanced Thermal Solutions (Brand).
* **16F:** Specific series/form factor.
* **101:** Size and fin configuration code.
* **C3:** Material/Thermal performance grade.
* **R0:** RoHS compliance status (Lead-free).
- ⤷
What is the significance of the 'LFM' rating when choosing this heat sink?
- ⤷ Does this model require a specific thermal interface material (TIM)?
- ⤷ How does the pushPIN mounting compare to clip-on heat sinks?