The **ATS-16F-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from integrated circuits like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the device: | Property | Value / Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Series** | maxiFLOW™ | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 1.87°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's configuration: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **16**: Internal series/product identifier. * **F**: Fin geometry (typically indicates "Fine" or a specific spread pattern). * **11**: Specific size or configuration code. * **C2**: Material and Finish (C2 usually denotes Blue Anodized Aluminum). * **R0**: RoHS compliance status (Lead-free). --- ### 3. Key Electronic/Mechanical Features #### A. High-Aspect Ratio Fin Design The maxiFLOW™ design features a graduated fin pattern. This maximizes surface area for heat exchange while minimizing the pressure drop, allowing air to flow through the sink more efficiently even at lower fan speeds. #### B. pushPIN™ Attachment Unlike adhesive tapes that can fail over time, this part uses a **pushPIN™** mechanism. This ensures: * Consistent pressure across the processor surface. * Reliable thermal contact. * Easy installation and removal via a spring-loaded bolt. #### C. Integrated Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-performance grease that fills microscopic air gaps between the heat sink and the chip, significantly improving heat transfer efficiency. --- ### 4. Application Use-Cases This specific heat sink is typically used in: 1. **Telecommunications**: Cooling high-speed network switches. 2. **Embedded Systems**: Industrial PCs and automation controllers. 3. **Data Centers**: Server components requiring low-profile cooling solutions (15mm height).