The **ATS-16F-116-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Push-Pin" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating ICs (Integrated Circuits). --- ### ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16F-116-C2-R0 | | **Attachment Type** | Push-Pin (Brass, 2-Pin) | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 4.14°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ## Component Breakdown ### 1. The Heat Sink Body The body is constructed from aluminum for a balance between weight, cost, and thermal conductivity. The **Blue Anodized** finish is not just aesthetic; it provides surface protection and slightly improves emissivity for radiant heat transfer. ### 2. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, this model uses a **Push-Pin** system: * **Spring-loaded Pins:** These ensure constant pressure between the heat sink and the component, optimizing heat transfer. * **Reliability:** Mechanical fastening is more reliable than thermal tape in high-vibration or high-temperature environments. * **Hardware:** The "R0" designation typically refers to the specific hardware kit included (brass pins and springs). ### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a "Phase Change" material that softens when the device heats up, filling microscopic air gaps between the chip and the heat sink to lower thermal resistance. --- ### ## Thermal Performance Thermal resistance indicates how effectively the part dissipates heat. A lower value is better. | Airflow (LFM - Linear Feet per Minute) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM** | 4.14 | | **300 LFM** | 2.50 | | **500 LFM** | 1.86 | --- ### ## Applications * **Embedded Systems:** Industrial PCs and controllers. * **Networking Hardware:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or voltage regulators.