The **ATS-16F-126-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product series, designed to maximize airflow and thermal dissipation for electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16F-126-C2-R0 | | **Heat Sink Type** | Fin (maxiFLOW) | | **Material** | Aluminum (Black Anodized) | | **Length x Width** | 54.00 mm x 54.00 mm | | **Height** | 15.00 mm | | **Thermal Resistance** | 2.03°C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | --- ### 2. Key Electronic Components & Features #### A. Thermal Interface Material (TIM) * **Pre-Applied Coating:** This part typically comes with a pre-applied thermal interface material to ensure low thermal resistance between the semiconductor (CPU, GPU, or FPGA) and the aluminum base. * **C2 Designation:** In the ATS naming convention, "C2" usually denotes a specific type of thermal performance or coating (often Blue Anodized or specific TIM application). #### B. The pushPIN™ Attachment System Instead of using adhesive tape, this part uses the **pushPIN™** system: * **Hardware:** Includes a brass or plastic pin with a stainless steel spring. * **Benefit:** Provides a precise and consistent pressure (load) on the electronic component, which is critical for maximizing heat transfer and preventing damage to delicate solder balls (BGA). #### C. maxiFLOW™ Fin Design * The fins are tapered to increase the surface area and reduce the "pressure drop" as air flows through the heat sink. * This design is particularly effective in high-velocity airflow environments found in server racks and telecommunications hardware. --- ### 3. Common Applications This heat sink is designed for high-power electronic components that generate significant heat during operation: * **ASICs and FPGAs:** Used in networking gear and high-speed computing. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. --- ### 4. Dimensional Summary ```text L: 54mm (Top View) +------------------+ | | | Top Fin | W: 54mm | Area | | | +------------------+ Height: 15mm (Side View) ```