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  • ATS-16F-128-C2-R0

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    The **ATS-16F-128-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink** assembly. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "maxiFLOW™" product line. --- ## 1. Technical Specifications This part is designed to provide thermal management for electronic components like CPUs, GPUs, or high-power ASICs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 46.99mm x 46.99mm | | **Height (Fin Height)** | 22.86mm | | **Thermal Resistance** | 2.91°C/W (at 200 LFM) | | **Flow Orientation** | Directional (High spread fin pattern) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment Unlike standard glue-on heat sinks, the "R0" suffix indicates a pushPIN™ attachment system. This ensures: * **Constant Pressure:** A brass spring provides precise, uniform pressure across the component (TIM), improving heat transfer. * **Secure Mounting:** It utilizes pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or shipping. ### B. maxiFLOW™ Design The internal geometry features a **tapered fin design**. In electronics, this reduces "pressure drop" while increasing the surface area. This is critical for densely packed PCBs where airflow might be obstructed by other tall components. ### C. Thermal Interface Material (TIM) The part comes pre-applied with **chomerics T766** or a similar high-performance phase-change material. This eliminates the need for manual thermal paste application during assembly. --- ## 3. Component Breakdown | Part Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **16F** | Fin style/density code | | **128** | Specific dimension/geometry identifier | | **C2** | Material/Finish (Blue Anodized Aluminum) | | **R0** | Revision/Kit type (Standard pushPIN™ assembly) | --- ### Application Usage This part is typically found in: 1. **Networking Hardware:** Routers and switches. 2. **Embedded Systems:** Industrial PCs. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN mounting system?
    • ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
    • ⤷ Are there alternative finishes to the blue anodized C2 coating for this model?