ATS-16F-128-C2-R0
AI

The **ATS-16F-128-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink** assembly. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to their "maxiFLOW™" product line.
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## 1. Technical Specifications
This part is designed to provide thermal management for electronic components like CPUs, GPUs, or high-power ASICs.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Attachment Method** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 46.99mm x 46.99mm |
| **Height (Fin Height)** | 22.86mm |
| **Thermal Resistance** | 2.91°C/W (at 200 LFM) |
| **Flow Orientation** | Directional (High spread fin pattern) |
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## 2. Key Electronic Features
### A. pushPIN™ Attachment
Unlike standard glue-on heat sinks, the "R0" suffix indicates a pushPIN™ attachment system. This ensures:
* **Constant Pressure:** A brass spring provides precise, uniform pressure across the component (TIM), improving heat transfer.
* **Secure Mounting:** It utilizes pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or shipping.
### B. maxiFLOW™ Design
The internal geometry features a **tapered fin design**. In electronics, this reduces "pressure drop" while increasing the surface area. This is critical for densely packed PCBs where airflow might be obstructed by other tall components.
### C. Thermal Interface Material (TIM)
The part comes pre-applied with **chomerics T766** or a similar high-performance phase-change material. This eliminates the need for manual thermal paste application during assembly.
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## 3. Component Breakdown
| Part Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **16F** | Fin style/density code |
| **128** | Specific dimension/geometry identifier |
| **C2** | Material/Finish (Blue Anodized Aluminum) |
| **R0** | Revision/Kit type (Standard pushPIN™ assembly) |
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### Application Usage
This part is typically found in:
1. **Networking Hardware:** Routers and switches.
2. **Embedded Systems:** Industrial PCs.
3. **Power Supplies:** Cooling MOSFETs or voltage regulators.
- ⤷
What are the PCB hole requirements for the pushPIN mounting system?
- ⤷ How does the thermal resistance change at different airflow speeds (LFM)?
- ⤷ Are there alternative finishes to the blue anodized C2 coating for this model?