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  • ATS-16F-140-C2-R0

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    The **ATS-16F-140-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is designed for cooling integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height (Fin)** | 25mm | | **Thermal Resistance** | 7.28°C/W (at 100 LFM) | | **Flow Direction** | Vertical/Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical characteristics: 1. **ATS-16**: Refers to the specific series and internal design family. 2. **F**: Indicates the attachment hole pattern/configuration. 3. **140**: Internal code for the specific fin design and density. 4. **C2**: Specifies the material and thermal interface material (TIM). In this case, it usually implies **T766** (a high-performance thermal grease). 5. **R0**: Refers to the revision and packaging (Standard RoHS compliant). --- ### 3. Key Electronic/Mechanical Features #### A. Thermal Performance This heat sink is designed to dissipate heat from high-power components. Its efficiency is measured by **Thermal Resistance**. At low airflow (100 LFM), the resistance is **7.28°C/W**, but it drops significantly (to approx. **2.14°C/W**) under high-velocity forced air (700 LFM). #### B. Push-Pin Attachment Unlike adhesive-based heat sinks, this model uses a mechanical **push-pin and brass spring** system. * **Reliability:** Provides constant pressure (preload) for better thermal contact. * **Maintenance:** Easily removable and re-installable without damaging the PCB. #### C. Straight Fin Design The fins are arranged in a straight-line pattern. This is optimized for **unidirectional airflow**, meaning it works best when placed in the path of a system fan. #### D. Blue Anodized Finish The blue anodization is not just for aesthetics; it increases the surface emissivity and protects the aluminum from corrosion/oxidation. --- ### 4. Common Applications * **Voltage Regulator Modules (VRMs)** * **Field Programmable Gate Arrays (FPGAs)** * **Small Form Factor (SFF) Computers** * **Network Switches and Routers**
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the push-pin attachment?
    • ⤷ How does the thermal resistance change if the airflow is passive (natural convection)?
    • ⤷ Is the thermal interface material (TIM) pre-applied to this part?