ATS-16F-140-C2-R0
AI

The **ATS-16F-140-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is designed for cooling integrated circuits (ICs) and other PCB-mounted components.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Dimensions (L x W)** | 25mm x 25mm |
| **Height (Fin)** | 25mm |
| **Thermal Resistance** | 7.28°C/W (at 100 LFM) |
| **Flow Direction** | Vertical/Straight Fin |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by ATS to identify the physical characteristics:
1. **ATS-16**: Refers to the specific series and internal design family.
2. **F**: Indicates the attachment hole pattern/configuration.
3. **140**: Internal code for the specific fin design and density.
4. **C2**: Specifies the material and thermal interface material (TIM). In this case, it usually implies **T766** (a high-performance thermal grease).
5. **R0**: Refers to the revision and packaging (Standard RoHS compliant).
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### 3. Key Electronic/Mechanical Features
#### A. Thermal Performance
This heat sink is designed to dissipate heat from high-power components. Its efficiency is measured by **Thermal Resistance**. At low airflow (100 LFM), the resistance is **7.28°C/W**, but it drops significantly (to approx. **2.14°C/W**) under high-velocity forced air (700 LFM).
#### B. Push-Pin Attachment
Unlike adhesive-based heat sinks, this model uses a mechanical **push-pin and brass spring** system.
* **Reliability:** Provides constant pressure (preload) for better thermal contact.
* **Maintenance:** Easily removable and re-installable without damaging the PCB.
#### C. Straight Fin Design
The fins are arranged in a straight-line pattern. This is optimized for **unidirectional airflow**, meaning it works best when placed in the path of a system fan.
#### D. Blue Anodized Finish
The blue anodization is not just for aesthetics; it increases the surface emissivity and protects the aluminum from corrosion/oxidation.
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### 4. Common Applications
* **Voltage Regulator Modules (VRMs)**
* **Field Programmable Gate Arrays (FPGAs)**
* **Small Form Factor (SFF) Computers**
* **Network Switches and Routers**
- ⤷
What are the PCB hole diameter requirements for the push-pin attachment?
- ⤷ How does the thermal resistance change if the airflow is passive (natural convection)?
- ⤷ Is the thermal interface material (TIM) pre-applied to this part?