The **ATS-16F-141-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Heat Sink Type** | Push-pin Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 15.76°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 10mm | | **Attachment Method** | Push-Pin (Spring-loaded) | --- ### Key Components & Features #### 1. Heat Sink Geometry The device uses a **straight fin** design. This is optimized for airflow that moves linearly across the component. The low profile (10mm height) makes it suitable for compact electronic enclosures or 1U server racks. #### 2. Material and Coating * **Aluminum:** Provides a lightweight balance between thermal conductivity and cost-effectiveness. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization increases the surface emissivity (improving radiant heat transfer) and provides a protective layer against corrosion and electrical conductivity. #### 3. pushPIN™ Attachment System The part number suffix indicates the mounting hardware. It utilizes a **Push-pin and Brass Spring** mechanism: * **Ease of Assembly:** Allows for quick installation without complex tools. * **Contact Pressure:** The spring ensures consistent downward pressure on the electronic chip, which is critical for maximizing the efficiency of the Thermal Interface Material (TIM). #### 4. Thermal Performance The efficiency of this heat sink varies based on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.76 | | 300 (1.5 m/s) | 8.38 | | 500 (2.5 m/s) | 6.35 | --- ### Application Usage * **Typical ICs:** Used for cooling BGA (Ball Grid Array) packages, FPGAs, and microprocessors. * **Industry:** Found in telecommunications, networking equipment, and industrial embedded systems.