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  • ATS-16F-145-C2-R0

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    The **ATS-16F-145-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like BGA, FPGA, or processors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-16F-145-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 2.90°C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T766 (High Performance Phase Change) | --- ### 2. Design Components and Features #### A. Fin Geometry This model uses **Straight Fins**. This design is optimized for environments with a specific directional airflow. The 30mm height provides a large surface area for heat exchange relative to its 30x30mm footprint. #### B. The pushPIN™ Attachment System The "16F" series utilizes the ATS pushPIN™ system. This consists of: * **Spring-loaded Pins:** These ensure constant, uniform pressure on the component being cooled, which maximizes the effectiveness of the Thermal Interface Material (TIM). * **Compression Springs:** They provide a secure mechanical fit to the PCB, preventing the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a phase-change material that softens as it reaches operating temperatures, filling microscopic gaps between the chip and the heat sink to minimize thermal resistance. --- ### 3. Performance Data (Airflow) The efficiency of the heat sink changes based on the velocity of the air moving through it (measured in Linear Feet per Minute - LFM): * **Unducted Flow (100 LFM):** ~4.73 °C/W * **Unducted Flow (200 LFM):** ~2.90 °C/W * **Unducted Flow (500 LFM):** ~1.77 °C/W --- ### 4. Part Number Breakdown The suffix **C2** indicates the material/finish (Blue Anodized Aluminum), and **R0** indicates the revision level or packaging standard.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required LFM for my specific chip wattage?
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?