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  • ATS-16F-160-C2-R0

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    The **ATS-16F-160-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications | Parameter | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.67°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 15mm | | **Weight** | ~40 grams | --- ### 2. Physical Design Features * **Fin Profile:** This model typically features a **Straight Fin** or **Cross-Cut** design. This geometry maximizes surface area for air interaction while maintaining low pressure drop. * **Push-Pin Attachment:** Instead of messy adhesives or simple clips, it uses a mechanical push-pin system. This provides consistent downward pressure (clamping force) on the component, improving thermal interface material (TIM) performance. * **Material:** Made from high-grade aluminum, which offers an excellent balance between thermal conductivity, weight, and cost. --- ### 3. Thermal Performance Indicators The efficiency of this part is measured by its thermal resistance (expressed in °C/W). Lower values indicate better cooling. * **Low Airflow (100 LFM):** ~6.67 °C/W * **High Airflow (700 LFM):** ~2.10 °C/W * **Application:** It is ideally suited for medium-height profiles where space is constrained but high thermal dissipation is required. --- ### 4. Part Number Breakdown Understanding the ATS nomenclature: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **16:** Designates the specific series/fin style. * **F:** Fin pitch/Density indicator. * **160:** Height or specific dimension code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code. ---
    ✨ Follow-up Questions
    • ⤷ What is the recommended thermal interface material (TIM) for this heat sink?
    • ⤷ How do I calculate if this heat sink is sufficient for a 20W power component?
    • ⤷ What are the PCB hole requirements for the push-pin mounting?