ATS-16F-160-C2-R0
AI

The **ATS-16F-160-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
| Parameter | Details |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 6.67°C/W (Unducted Flow @ 100 LFM) |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Dimensions** | 45mm x 45mm x 15mm |
| **Weight** | ~40 grams |
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### 2. Physical Design Features
* **Fin Profile:** This model typically features a **Straight Fin** or **Cross-Cut** design. This geometry maximizes surface area for air interaction while maintaining low pressure drop.
* **Push-Pin Attachment:** Instead of messy adhesives or simple clips, it uses a mechanical push-pin system. This provides consistent downward pressure (clamping force) on the component, improving thermal interface material (TIM) performance.
* **Material:** Made from high-grade aluminum, which offers an excellent balance between thermal conductivity, weight, and cost.
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### 3. Thermal Performance Indicators
The efficiency of this part is measured by its thermal resistance (expressed in °C/W). Lower values indicate better cooling.
* **Low Airflow (100 LFM):** ~6.67 °C/W
* **High Airflow (700 LFM):** ~2.10 °C/W
* **Application:** It is ideally suited for medium-height profiles where space is constrained but high thermal dissipation is required.
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### 4. Part Number Breakdown
Understanding the ATS nomenclature:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **16:** Designates the specific series/fin style.
* **F:** Fin pitch/Density indicator.
* **160:** Height or specific dimension code.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging code.
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- ⤷
What is the recommended thermal interface material (TIM) for this heat sink?
- ⤷ How do I calculate if this heat sink is sufficient for a 20W power component?
- ⤷ What are the PCB hole requirements for the push-pin mounting?