The **ATS-16F-170-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of electronic components like CPUs, GPUs, and power modules. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Specification | Value / Detail | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 25.0 mm x 25.0 mm | | **Height** | 15.0 mm | | **Mounting Type** | Push-Pin (Plastic) | | **Spring Type** | Stainless Steel (ATS-PPS-16) | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | | **Attachment Hole Pitch** | 30.0 mm | --- ## 2. Thermal Performance Data Thermal resistance is measured in °C/W (Degrees Celsius per Watt). Lower values indicate better heat dissipation. | Air Velocity (Linear Feet per Min) | 100 (0.5 m/s) | 200 (1.0 m/s) | 400 (2.0 m/s) | 600 (3.0 m/s) | | :--- | :---: | :---: | :---: | :---: | | **Unducted Flow (°C/W)** | 10.07 | 6.30 | 4.62 | 3.89 | | **Ducted Flow (°C/W)** | 5.17 | 3.89 | 3.30 | 2.94 | --- ## 3. Key Electronic Design Features ### A. Push-Pin Attachment Mechanism This part uses a specific push-pin assembly rather than adhesive. This is critical for electronics for several reasons: * **Constant Pressure:** The stainless steel springs ensure a precise, uniform load on the electronic package, optimizing thermal transfer. * **Reliability:** Unlike thermal tape, push-pins do not degrade with heat or time, preventing the heat sink from falling off during vibration. ### B. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766** thermal material. This is a high-performance phase-change material that fills the microscopic air gaps between the chip and the heat sink base, significantly reducing thermal resistance compared to air. ### C. Fin Geometry The "F" in the part number designates a **Fine Pitch** fin pattern. This increases the surface area available for convection, making it ideal for electronic enclosures where space is limited but high heat dissipation is required. --- ## 4. Part Number Breakdown ```text ATS - 16 F - 170 - C2 - R0 | | | | | | | | | +-- Revision Code | | | +------- Thermal Interface Material (T766) | | +------------- Height (15.0mm) | +-------------------- Fin Pattern (Fine Pitch) +-------------------------- Manufacturer (Advanced Thermal Solutions) ```