The **ATS-16F-171-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (H)** | 20.00 mm | | **Pitch (Spacing)** | 35.00 mm (between holes) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.33 °C/W (at 100 LFM) | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) The unit comes pre-applied with **T766** thermal phase change material. This ensures low thermal resistance between the component (CPU/GPU) and the heat sink base, maximizing heat transfer. #### B. Push-Pin Attachment Mechanism Instead of using adhesive or solder, this part uses a mechanical push-pin system. * **Benefits:** Provides consistent pressure for optimal thermal contact and allows for easy removal/rework without damaging the PCB. * **Hardware:** Uses brass or plastic pins with a stainless steel compression spring. #### C. Fin Design The "171" designation typically refers to a specific fin pattern (Cross-cut or straight fin). This design is optimized for **forced air cooling** (active airflow from a fan), allowing air to flow through the fins and carry heat away from the sensitive electronic silicon. --- ### 3. Application Use Cases This specific heat sink is commonly found in the following electronic environments: * **Networking Equipment:** Routers, switches, and gateways. * **Industrial PCs:** Compact embedded systems where space is limited but heat density is high. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Telecommunications:** High-speed data processing units.