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  • ATS-16F-173-C2-R0

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    ## Technical Overview of ATS-16F-173-C2-R0 The **ATS-16F-173-C2-R0** is a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs where space is limited but thermal performance is critical. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16F-173-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is essential for PCB layout and clearance planning. * **Size (Length x Width):** 30.00 mm x 30.00 mm * **Height:** 30.00 mm (measured from the base to the top of the fins) * **Fin Style:** Cross-Cut (allows for multi-directional airflow) --- ### 3. Thermal Performance Data Thermal resistance indicates how effectively the heat sink dissipates heat (measured in degrees Celsius per Watt, °C/W). Lower values represent better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (Unducted)** | 4.72 | | **300 (Unducted)** | 2.95 | | **400 (Unducted)** | 2.41 | | **600 (Unducted)** | 1.83 | --- ### 4. Component Breakdown #### A. The Heat Sink Body The body uses **cross-cut fins**. Unlike standard straight fins, cross-cut fins allow air to enter from multiple angles, making it highly efficient in systems where the direction of the fan's airflow might not be perfectly aligned with the heat sink. #### B. The Push-Pin Mechanism The "R0" designation refers to the attachment kit. It uses a **brass push-pin** with a **compression spring**. * **Benefits:** Ensures consistent pressure (clamping force) between the heat sink and the chip. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Purpose:** It fills the microscopic air gaps between the component surface and the heat sink base to maximize heat transfer. --- ### 5. Part Number Decoding Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **16F:** Series/Family type * **173:** Specific dimension/fin configuration code * **C2:** Material/Finish (Aluminum, Blue Anodized) * **R0:** Attachment/TIM package
    ✨ Follow-up Questions
    • ⤷ What are the recommended PCB hole sizes for the brass push-pins used in this model?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used in a passive cooling environment without a fan?