The part number **ATS-16F-174-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series, designed specifically for thermal management in electronic systems like processors and power modules. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Base Dimensions** | 30.00 mm x 30.00 mm | | **Height** | 35.00 mm | | **Pin Pitch** | Fine-Pitch | | **Pattern** | XC (Cross-cut) | | **Thermal Resistance** | 4.02°C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention used by ATS to identify the product's attributes: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **16F**: Refers to the specific series and mounting hardware (pushPIN™ style). * **174**: The specific internal model number for the fin geometry and base size. * **C2**: Indicates the material and finish (typically Aluminum with a Blue Anodized coating). * **R0**: Refers to the packaging and revision status. --- ### 3. Key Component Features * **Cross-Cut (XC) Design:** The fins are cut in both directions, allowing for multi-directional airflow. This makes it highly efficient in crowded PCB environments where air might not flow in a single straight path. * **pushPIN™ Attachment:** This system replaces traditional adhesive tapes. It uses a flexible spring and pin mechanism that ensures constant pressure on the electronic component (CPU/GPU), improving heat transfer. * **Thermal Interface Material (TIM):** These units typically come with pre-applied high-performance thermal grease or pads on the base to ensure a seamless connection to the chip. * **High Aspect Ratio:** With a height of 35mm on a 30mm base, this heatsink is designed for vertical clearance to maximize surface area for cooling. --- ### 4. Applications This part is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from MOSFETs or power regulators.