The **ATS-16F-182-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is designed for cooling high-power electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Pitch** | Fine Pitch | | **Pattern** | Square (4-corner attachment) | | **Thermal Resistance** | ~7.48°C/W (at 100 LFM) | --- ### 2. Physical Design Details * **Fin Profile:** This model typically features a **Straight Fin** or **Cross-cut** design. The "Fine Pitch" indicates a high density of fins, which increases the surface area for heat dissipation but requires consistent airflow to be effective. * **Base Material:** Made of 6063 aluminum, which offers a balance of high thermal conductivity and structural integrity. * **Blue Anodized Coating:** The finish is not just for aesthetics; it protects the aluminum from oxidation and slightly increases surface emissivity for better radiation heat transfer. --- ### 3. Mounting System (pushPIN™) The "R0" suffix refers to the specific attachment kit included. This system replaces traditional adhesives or clips: 1. **Springs:** Provides a precise amount of "Pre-load" (pressure) to ensure maximum contact between the heat sink and the electronic component. 2. **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes on the PCB. 3. **Thermal Interface Material (TIM):** This part usually comes with a pre-applied high-performance thermal pad or grease (often ATS-PPS-16) to fill microscopic air gaps. --- ### 4. Application Use Case This specific height (15mm) and footprint (40mm) make it ideal for: * **Networking Equipment:** Routers and switches with 1U or 2U form factors. * **Industrial PCs:** Cooling logic controllers or embedded processors. * **Power Supplies:** Managing heat for MOSFETs or voltage regulators. ---