ATS-16F-186-C2-R0
AI

The **ATS-16F-186-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### Technical Specifications
The following table outlines the key physical and thermal properties of this specific model:
| Attribute | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Base Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance (Unducted)** | 2.80°C/W @ 100 LFM |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 35.00mm |
| **Fin Style** | Straight Fin |
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### Core Components and Features
#### 1. Push-Pin Attachment Mechanism
The "16F" in the part number indicates a specific push-pin configuration. This system uses a flexible spring-loaded pin that passes through pre-drilled holes in the PCB. It provides:
* **Constant Pressure:** Ensures the heat sink remains in tight contact with the component.
* **Ease of Assembly:** No specialized tools are required for installation.
#### 2. Material and Coating
* **Aluminum Body:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodized Finish:** The "C2" suffix refers to the finish. Anodizing increases corrosion resistance and slightly improves radiative heat transfer.
#### 3. Fin Profile
This model uses a **straight-fin** design. This is optimized for **forced air cooling** (where a fan is present). The 35mm height provides a large surface area for heat exchange compared to low-profile alternatives.
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### Thermal Performance Overview
Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better cooling efficiency.
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 2.80 |
| 300 | 1.5 | 1.39 |
| 500 | 2.5 | 1.05 |
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### Application Usage
The **ATS-16F-186-C2-R0** is typically found in:
* **Networking Equipment:** High-speed routers and switches.
* **Industrial PCs:** Compact systems requiring passive or active airflow cooling.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
- ⤷
What are the PCB hole requirements for the push-pin mounting of this heat sink?
- ⤷ How does the 'C2' blue anodized finish compare to 'C1' or 'C3' versions?
- ⤷ Can this heat sink be used with a standard 40mm fan attached directly to the fins?