The **ATS-16F-187-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to the **pushPIN™** series. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-16F-187-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 2.52 °C/W (@ 100 LFM) | | **Flow Pattern** | XC-CUT (Cross-Cut) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | --- ### Key Electronic & Mechanical Components #### 1. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex screws, this part uses a **pushPIN™** system. It consists of: * **Brass/Plastic Pins:** Used to secure the sink to the PCB. * **Compression Springs:** These provide precise, uniform pressure (force) across the thermal interface material (TIM) to ensure maximum heat transfer. #### 2. XC-CUT Fin Design The "XC" in the part number indicates a **Cross-Cut** fin geometry. Unlike straight fins that only allow airflow in one direction, cross-cut fins allow for **multi-directional airflow**. This makes it ideal for dense electronic enclosures where airflow direction might be turbulent or inconsistent. #### 3. Thermal Interface Material (TIM) The "R0" suffix usually denotes that the part comes with **T766** pre-applied thermal interface material. This is a high-performance phase-change material or grease that fills the microscopic air gaps between the electronic component (CPU, FPGA, or MOSFET) and the aluminum base of the heat sink. #### 4. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * **Corrosion resistance:** Protects the aluminum from oxidation. * **Electrical Insulation:** Provides a thin layer of non-conductive protection on the surface. * **Thermal Emissivity:** Improves heat radiation slightly compared to raw aluminum. --- ### Applications * **FPGAs & ASICs:** Cooling high-speed processing chips. * **Power Supplies:** Managing heat in MOSFETs and voltage regulators. * **Telecommunications:** Used in routers and switches where vertical space (10mm height) is limited.