The **ATS-16F-204-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 35.00mm | | **Thermal Resistance** | 0.74°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. Fin Design (Cross-Cut) The "204" in the part number refers to a specific fin configuration. This model features a **cross-cut fin pattern**, which allows for omnidirectional airflow. This is ideal for systems where the direction of the cooling air may vary or be turbulent. #### B. PushPIN™ Attachment System Instead of using messy adhesives or simple clips, this part uses the **pushPIN™** system. It consists of: * **Brass/Plastic Pins:** Used to secure the sink to the PCB. * **Compression Springs:** Provides precise, uniform pressure (load) on the component to ensure optimal thermal contact. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**, a high-performance phase-change material. This ensures that the microscopic gaps between the heat sink and the electronic chip are filled, reducing thermal resistance. --- ### 3. Part Number Decoder Understanding the "ATS-16F-204-C2-R0" nomenclature: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **16** | Series number | | **F** | Fin style (e.g., Fine/Dense) | | **204** | Dimensions and fin geometry code | | **C2** | Thermal performance/Material grade | | **R0** | RoHS compliant and Revision code | --- ### 4. Application Use Cases This heat sink is typically found in: * **Telecommunications:** High-speed routers and switches. * **Computing:** Embedded servers and industrial PCs. * **Power Electronics:** Large MOSFET or IGBT arrays requiring active/passive cooling.