ATS-16F-207-C2-R0
AI

The **ATS-16F-207-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink** assembly. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to the **blueICE™** series.
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### 1. Technical Specifications
This part is designed for thermal management of surface-mount components like CPUs, GPUs, or FPGAs.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Part Number** | ATS-16F-207-C2-R0 |
| **Thermal Resistance** | 6.39°C/W (at 100 LFM) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions** | 60mm x 60mm x 6mm |
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### 2. Key Design Elements
* **Fin Profile:** The "F" in the part number typically denotes a **Fine Pitch** fin pattern. This increases the surface area for heat dissipation, making it ideal for high-velocity airflow environments.
* **pushPIN™ Attachment:** This system replaces traditional adhesive tapes with a secure mechanical connection. It features a flexible spring mechanism that provides precise pressure for optimal thermal interface material (TIM) performance.
* **Material Choice:** Made of lightweight aluminum, it provides a balance between thermal conductivity and weight, ensuring it doesn't stress the PCB.
* **Low Profile:** With a height of only 6.00mm, it is designed for space-constrained applications like blade servers or 1U rackmount systems.
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### 3. Thermal Performance Matrix
Thermal resistance varies based on the airflow (Measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 6.39 |
| 300 (1.5 m/s) | 2.86 |
| 500 (2.5 m/s) | 2.09 |
| 700 (3.5 m/s) | 1.73 |
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### 4. Part Number Breakdown (Example)
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **16:** Series / Attachment Type
* **F:** Fin Pitch (Fine)
* **207:** Dimensions/Geometry code
* **C2:** Material/Color (Blue Anodized Aluminum)
* **R0:** RoHS Compliance status
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What is the significance of the pushPIN™ attachment system over traditional thermal tape?
- ⤷ How does the 'Fine Pitch' fin design affect performance in natural convection vs. forced airflow?
- ⤷ Are there specific Thermal Interface Materials (TIM) recommended for use with this heat sink?