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  • ATS-16F-207-C2-R0

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    The **ATS-16F-207-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink** assembly. It is manufactured by *Advanced Thermal Solutions (ATS)* and belongs to the **blueICE™** series. --- ### 1. Technical Specifications This part is designed for thermal management of surface-mount components like CPUs, GPUs, or FPGAs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-16F-207-C2-R0 | | **Thermal Resistance** | 6.39°C/W (at 100 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions** | 60mm x 60mm x 6mm | --- ### 2. Key Design Elements * **Fin Profile:** The "F" in the part number typically denotes a **Fine Pitch** fin pattern. This increases the surface area for heat dissipation, making it ideal for high-velocity airflow environments. * **pushPIN™ Attachment:** This system replaces traditional adhesive tapes with a secure mechanical connection. It features a flexible spring mechanism that provides precise pressure for optimal thermal interface material (TIM) performance. * **Material Choice:** Made of lightweight aluminum, it provides a balance between thermal conductivity and weight, ensuring it doesn't stress the PCB. * **Low Profile:** With a height of only 6.00mm, it is designed for space-constrained applications like blade servers or 1U rackmount systems. --- ### 3. Thermal Performance Matrix Thermal resistance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.39 | | 300 (1.5 m/s) | 2.86 | | 500 (2.5 m/s) | 2.09 | | 700 (3.5 m/s) | 1.73 | --- ### 4. Part Number Breakdown (Example) * **ATS:** Manufacturer (Advanced Thermal Solutions) * **16:** Series / Attachment Type * **F:** Fin Pitch (Fine) * **207:** Dimensions/Geometry code * **C2:** Material/Color (Blue Anodized Aluminum) * **R0:** RoHS Compliance status
    ✨ Follow-up Questions
    • ⤷ What is the significance of the pushPIN™ attachment system over traditional thermal tape?
    • ⤷ How does the 'Fine Pitch' fin design affect performance in natural convection vs. forced airflow?
    • ⤷ Are there specific Thermal Interface Materials (TIM) recommended for use with this heat sink?