## Electronic Specifications: ATS-16F-21-C2-R0 The **ATS-16F-21-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling electronic components such as processors, FPGAs, and GPUs. --- ### 1. General Product Specifications This part is defined by its material composition, attachment method, and thermal performance characteristics. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-16F-21-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 16.28°C/W (at 100 LFM) | | **Dimensions** | 60mm x 60mm | | **Height** | 10mm | --- ### 2. Physical Construction The "F" in the part number indicates a **Fine Pitch** design, which provides a larger surface area for heat dissipation in environments with higher airflow. * **Fins:** Rectangular fin array optimized for straight-line airflow. * **Base:** Flat aluminum base for maximum contact with the electronic component (TIM - Thermal Interface Material is usually pre-applied). * **Mounting:** Uses a brass pushPIN and a stainless steel spring to provide consistent pressure, ensuring a reliable thermal bond. --- ### 3. Thermal Performance (Airflow Data) Thermal resistance indicates how efficiently the heat sink transfers heat to the surrounding air. Lower values (measured in °C/W) are better. | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 16.28 °C/W | 4.84 °C/W | 2.56 °C/W | 1.87 °C/W | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS**: Advanced Thermal Solutions. * **16**: Series number. * **F**: Fine pitch fin pattern. * **21**: Specific dimension/geometry code. * **C2**: Material/Color code (Blue Anodized). * **R0**: Revision/Packaging code. ---