The **ATS-16F-210-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 70.00 mm x 70.00 mm | | **Height** | 15.00 mm | | **Hole Pattern** | 63.00 mm x 63.00 mm | | **Thermal Resistance** | 2.45 °C/W (at 200 LFM) | | **Flow Orientation** | Vertical Fin (Straight Line) | --- ## 2. Key Features and Components ### A. Material and Design * **Aluminum Construction:** Provides a balance between high thermal conductivity and low weight. * **Straight Fin Design:** The fins are arranged in a straight-line pattern, optimized for systems with directed airflow (ducted airflow). * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied high-performance thermal pad (T412) to ensure efficient heat transfer from the chip to the sink. ### B. pushPIN™ Attachment System This part uses a specific mounting mechanism rather than just adhesive: 1. **Springs:** Provides consistent pressure to ensure the heat sink remains in contact with the component during thermal expansion or vibration. 2. **Plastic/Brass Pins:** The pins lock into pre-drilled holes in the PCB. 3. **Hardware:** The "R0" suffix generally indicates the hardware kit included (standard springs and plastic pins). --- ## 3. Thermal Performance (Deg C/W) The efficiency of the heat sink depends heavily on the velocity of the air moving through it (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 4.49 °C/W | 1.77 °C/W | 1.25 °C/W | --- ## 4. Usage Considerations * **Clearance:** The 15mm height is relatively low-profile for a 70x70mm footprint, making it suitable for 1U or 2U server rack environments. * **Compatibility:** Ensure the PCB has the matching 63mm x 63mm hole pattern before selection. * **Environment:** The Blue Anodized finish is not just for aesthetics; it provides corrosion resistance and increases surface emissivity.