The **ATS-16F-22-C3-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). --- ## 1. Component Overview This part is part of the **pushPIN™** Heat Sink Assembly line. It is designed for cooling electronic components like CPUs, GPUs, or high-power transistors on a Printed Circuit Board (PCB). ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 13.88 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 12.70mm | --- ## 2. Key Electronic Features ### A. High-Performance Fin Design The "F" in the part number signifies a **Fine Pitch** or specific fin geometry. The design uses a cross-cut pattern to create a "Pin Fin" array. This increases the surface area significantly, allowing for better heat dissipation in both natural and forced convection environments. ### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a spring-loaded push-pin mechanism. * **Benefits:** Provides consistent pressure (Pre-assembled springs) for maximum heat transfer. * **Reliability:** Ensures the heat sink remains securely attached during mechanical shock or vibration. ### C. Thermal Interface Material (TIM) The part typically comes with **T412** thermal interface material pre-applied to the bottom base. This fills the microscopic air gaps between the heat sink and the electronic component, ensuring efficient thermal conductivity. --- ## 3. Part Number Breakdown Understanding the nomenclature helps identify the exact physical properties: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **16** | Series Number | | **F** | Fin Pitch (Fine) | | **22** | Specific Model ID | | **C3** | Thermal Interface Material (T412) & Color | | **R0** | RoHS Compliant / Revision | --- ## 4. Application Use Cases This component is commonly used in: * **Telecommunications:** Cooling signal processors. * **Industrial PCs:** Maintaining stability in high-ambient temperatures. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.