The **ATS-16F-26-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** as part of their "push-pin" attachment series. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-16F-26-C2-R0 | | **Product Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 14.20°C/W @ 100 LFM (Flowing air) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Style** | Straight Fin | --- ## Electronic & Physical Components ### 1. The Heat Sink Body The main body is made of **Aluminum 6063**. Aluminum is preferred in electronics for its high thermal conductivity and lightweight properties. The "Blue Anodized" finish is not just for aesthetics; it provides a protective layer against corrosion and slightly improves radiant heat transfer. ### 2. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the **R0** designation indicates a specific attachment kit: * **Push-Pins:** These are typically spring-loaded plastic pins that pass through pre-drilled holes in the PCB. * **Compression Spring:** A brass or steel spring provides consistent pressure across the interface to ensure maximum contact between the chip and the heat sink. ### 3. Thermal Interface Material (TIM) The "C2" in the part number usually refers to the thermal interface material provided. * **ATS-PPS (Phase Change Material):** This is a pre-applied pad on the base of the heat sink. When the electronic component heats up, the material softens to fill microscopic gaps between the chip and the metal, significantly reducing thermal resistance. --- ## Performance Analysis The efficiency of this part depends heavily on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Natural/Low)** | 14.20 | | **300 (Moderate)** | 4.95 | | **500 (High)** | 3.54 | --- ## Common Applications This heat sink is designed for mid-sized electronic packages, including: * **BGA (Ball Grid Array):** Graphics chips, processors, and chipsets. * **FPGA:** Field Programmable Gate Arrays that generate significant heat in telecommunications. * **Network Switches:** Used to cool high-speed processing units.