The **ATS-16F-30-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16F-30-C3-R0 | | **Thermal Resistance** | 5.35°C/W @ 100 LFM | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimension (L x W)** | 35.00mm x 35.00mm | | **Height** | 25.00mm | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps identify the exact configuration: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **16:** Designates the series (Cross-Cut fin design). * **F:** Fin pitch/density indicator. * **30:** Height code (25mm-30mm range depending on specific series mapping). * **C3:** Performance and attachment type (Blue Anodized finish, specific thermal interface material). * **R0:** RoHS Compliance/Revision status. --- ### 3. Key Electronic Functions * **Heat Dissipation:** It increases the surface area of a semiconductor package, allowing air to carry away heat via convection (passive or forced). * **Thermal Interface Material (TIM):** This part usually comes with a pre-applied thermal pad (often "Phase Change" material) to minimize the air gap between the component and the metal. * **Mechanical Stability:** The "Push-Pin" system includes a spring-loaded mechanism that ensures consistent pressure across the chip, preventing "hot spots" caused by uneven contact. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and routers. * **Telecommunications:** Network switches and base stations. * **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs) that produce significant heat in small footprints. ---