The **ATS-16F-33-C3-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications | Parameter | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-16F-33-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | Straight (Standard Profile) | | **Thermal Resistance** | Variable based on Airflow (LFM) | --- ## 2. Physical Dimensions The dimensions are critical for ensuring the heatsink fits within the PCB layout and does not interfere with surrounding components. * **Length:** 36.83 mm * **Width:** 36.83 mm * **Height:** 20.00 mm * **Pitch (Hole Spacing):** Standardized for specific grid layouts. --- ## 3. Key Electronic/Thermal Features ### A. Material & Surface Treatment The unit is made from high-grade aluminum. The **Blue Anodized** finish is not just for aesthetics; it provides: * Increased surface emissivity for better radiation heat transfer. * Corrosion resistance. * Electrical insulation to prevent short circuits if touched by stray wires. ### B. Attachment Mechanism (Push-Pin) Unlike adhesive-based heatsinks, the **ATS-16F-33-C3-R0** uses a mechanical push-pin system with a brass spring. 1. **Uniform Pressure:** The spring ensures constant contact between the heatsink base and the component. 2. **Reliability:** Mechanical mounting is preferred in high-vibration environments where thermal tape might fail. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the presence of a pre-applied **Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring an even and optimal thermal bridge between the chip and the aluminum fins. --- ## 4. Performance Context This heatsink is designed for **forced air cooling** environments. Its thermal resistance decreases significantly as the Linear Feet per Minute (LFM) of airflow increases, making it ideal for devices housed in chassis with active fans. ---