The **ATS-16F-38-C3-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed for cooling semiconductor devices like CPUs, FPGAs, and GPUs. --- ## 1. Technical Specifications Below is a breakdown of the core technical parameters for this part: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-16F-38-C3-R0 | | **Type** | Board Level Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 0.84°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 46.45mm x 22.86mm | | **Thermal Interface Material** | T412 (Pre-applied) | --- ## 2. Key Electronic Components & Design Features ### A. The maxiFLOW™ Geometry Unlike standard square fin heat sinks, this part uses a **tapered fin design**. This increases the surface area for heat dissipation while reducing pressure drop, allowing air to flow more efficiently through the fins. ### B. pushPIN™ Attachment System This component uses a specialized mounting mechanism: * **Spring-loaded Pins:** Ensures consistent pressure (clamping force) between the heat sink and the electronic component (like a processor). * **Reliability:** Prevents the heat sink from shifting during vibration or shipping, which is critical for long-term electronic stability. ### C. Thermal Interface Material (TIM) The part comes with **T412** pre-applied. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat source and the heat sink, significantly improving thermal conductivity. --- ## 3. Performance Analysis The efficiency of the ATS-16F-38-C3-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 0.84 | | **300 (1.5 m/s)** | 0.69 | | **400 (2.0 m/s)** | 0.60 | --- ## 4. Application Areas This heat sink is typically used in high-density electronic environments, including: * **Telecommunications:** Network switches and routers. * **Data Centers:** Server blades and storage controllers. * **Embedded Systems:** Industrial PCs where space is limited but heat generation is high.