## Technical Overview: ATS-16F-40-C3-R0 The **ATS-16F-40-C3-R0** is a high-performance **Heat Sink** assembly designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, which is characterized by a flared fin design to maximize airflow and thermal dissipation in constrained electronic environments. --- ### 1. Key Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 1.50°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 57.6mm x 76.2mm x 14.5mm | | **Fin Type** | Flared Fin | --- ### 2. Physical and Material Components * **Flared Fin Geometry:** The fins are angled outwards. This design reduces pressure drop and increases the surface area exposed to airflow, making it more efficient than standard straight-fin heat sinks. * **Blue Anodized Finish:** The aluminum is treated with a blue anodized coating. This not only prevents corrosion but also slightly increases thermal emissivity, helping with radiative cooling. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or a high-performance thermal pad, ensuring a low thermal resistance bond between the component (CPU/FPGA) and the heat sink. --- ### 3. Mechanical Attachment: The pushPIN™ System The part uses the proprietary **pushPIN™** attachment mechanism. This is critical for electronic assembly for several reasons: 1. **Uniform Pressure:** The integrated springs ensure that a constant, specific amount of pressure is applied to the electronic component, preventing damage while maximizing heat transfer. 2. **Ease of Installation:** It requires pre-drilled holes in the PCB. The plastic or brass pins snap into place, locking the heat sink securely. 3. **Vibration Resistance:** The spring-loaded nature makes it suitable for industrial or automotive environments where vibration is common. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.50 | | 400 (2.0 m/s) | 0.88 | | 600 (3.0 m/s) | 0.67 | --- ### 5. Common Applications * **Telecommunications:** Cooling high-speed switches and routers. * **Embedded Systems:** High-power processors and FPGAs. * **Power Supplies:** Heat dissipation for MOSFETs and power modules.