## Electronic Parts Overview: ATS-16F-41-C1-R0 The **ATS-16F-41-C1-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-16F-41-C1-R0 | | **Attachment Method** | Push Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance (LFM 100)** | 10.02 °C/W | | **Thermal Resistance (LFM 700)** | 2.26 °C/W | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCBA (Printed Circuit Board Assembly) layout: * **Dimension A (Length):** 45.00 mm * **Dimension B (Width):** 45.00 mm * **Dimension C (Height):** 10.00 mm * **Dimension E (Pitch):** 38.00 mm * **Dimension F (Pitch):** 38.00 mm --- ### 3. Key Features and Design The "41" in the part number identifies the specific fin pattern and geometry designed by ATS. * **Heat Sink Profile:** It features a **Straight Fin** design, which provides a low profile suitable for space-constrained environments while maximizing surface area for heat dissipation. * **Push-Pin Attachment:** This part uses a specialized push-pin mechanism. This allows for easy installation, consistent pressure on the heat source (like a CPU or GPU), and eliminates the need for messy adhesives. * **Thermal Interface Material (TIM):** It typically comes with a pre-applied thermal interface material (like ATS-T766) to ensure optimal heat transfer between the component and the heat sink. * **Material Efficiency:** Made from high-grade aluminum, it balances thermal conductivity with a lightweight footprint. --- ### 4. Applications This component is typically found in: 1. **Telecommunications:** Cooling of routers and switches. 2. **Embedded Systems:** For industrial computing modules. 3. **Consumer Electronics:** High-heat generating chips in small form-factor devices. 4. **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.