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  • ATS-16F-41-C3-R0

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    The **ATS-16F-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### 1. Key Technical Specifications Below are the critical technical parameters for the ATS-16F-41-C3-R0: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Thermal Resistance** | 10.07 °C/W (at 100 LFM) | | **Fin Pattern** | Square-Cut (Cross-Cut) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Design Components #### A. Fin Geometry (Square-Cut) The "Square-Cut" or "Cross-Cut" design features a grid of vertical pins/fins. This design is highly effective for: * **Omnidirectional Airflow:** It can receive cooling air from any direction, unlike straight-fin heat sinks which require the airflow to be aligned with the channels. * **Turbulence Induction:** The breaks between fins create turbulence, which breaks up the boundary layer of air and improves heat transfer efficiency. #### B. The pushPIN™ Attachment System This part uses a specific mounting mechanism rather than adhesive: * **Spring-loaded Bolts:** Provides consistent pressure (clamping force) on the high-power component to ensure maximum thermal contact. * **Ease of Install:** Designed for quick assembly onto a PCB with pre-drilled holes. #### C. Thermal Interface Material (T412) The part comes with **T412** pre-applied to the base. This is a high-performance thermal pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 3. Applications The ATS-16F-41-C3-R0 is typically used in environments where space is moderate but cooling requirements are high: * **Telecommunications:** Cooling of high-speed processors or ASICs. * **Industrial PC:** Thermal management for embedded controllers. * **Networking Hardware:** Routers and switches that require reliable 24/7 operation. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting this heat sink?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance?
    • ⤷ Can the T412 thermal material be replaced with a different compound?