ATS-16F-41-C3-R0
AI

The **ATS-16F-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs).
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### 1. Key Technical Specifications
Below are the critical technical parameters for the ATS-16F-41-C3-R0:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 20mm |
| **Thermal Resistance** | 10.07 °C/W (at 100 LFM) |
| **Fin Pattern** | Square-Cut (Cross-Cut) |
| **Thermal Interface Material (TIM)** | T412 (Pre-applied) |
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### 2. Design Components
#### A. Fin Geometry (Square-Cut)
The "Square-Cut" or "Cross-Cut" design features a grid of vertical pins/fins. This design is highly effective for:
* **Omnidirectional Airflow:** It can receive cooling air from any direction, unlike straight-fin heat sinks which require the airflow to be aligned with the channels.
* **Turbulence Induction:** The breaks between fins create turbulence, which breaks up the boundary layer of air and improves heat transfer efficiency.
#### B. The pushPIN™ Attachment System
This part uses a specific mounting mechanism rather than adhesive:
* **Spring-loaded Bolts:** Provides consistent pressure (clamping force) on the high-power component to ensure maximum thermal contact.
* **Ease of Install:** Designed for quick assembly onto a PCB with pre-drilled holes.
#### C. Thermal Interface Material (T412)
The part comes with **T412** pre-applied to the base. This is a high-performance thermal pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance.
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### 3. Applications
The ATS-16F-41-C3-R0 is typically used in environments where space is moderate but cooling requirements are high:
* **Telecommunications:** Cooling of high-speed processors or ASICs.
* **Industrial PC:** Thermal management for embedded controllers.
* **Networking Hardware:** Routers and switches that require reliable 24/7 operation.
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- ⤷
What are the PCB hole requirements for mounting this heat sink?
- ⤷ How does the 'Blue Anodized' finish affect thermal performance?
- ⤷ Can the T412 thermal material be replaced with a different compound?