The **ATS-16F-45-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 30mm x 30mm x 20mm | | **Fin Style** | Straight Fin (provides high surface area) | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance** | 5.82 °C/W (at 100 LFM) | | **TIM (Thermal Interface Material)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **16**: Series identifier. * **F**: Fin pitch/density (Fine). * **45**: Specific design variation. * **C3**: Thermal Interface Material (TIM) type and color/finish. * **R0**: RoHS compliance status and revision. --- ### 3. Key Electronic Components & Features #### A. Thermal Interface Material (TIM) The "C3" designation indicates it comes with **T412** material pre-applied to the base. This is a high-conductivity thermal tape that eliminates the air gap between the heat-generating electronic component (the die) and the aluminum heat sink, ensuring maximum heat transfer. #### B. pushPIN™ Attachment Instead of using messy adhesives or permanent solder, this part uses a mechanical **pushPIN™** system. * **Benefits:** Provides consistent pressure for better thermal contact and allows for easy removal/rework of the PCB without damaging components. * **Springs:** Usually stainless steel or brass to maintain tension over the life of the product. #### C. Fin Geometry The "Straight Fin" design is optimized for **forced air cooling** (fans). In an electronic enclosure, this design allows air to flow through the channels, carrying heat away from the sensitive silicon layers. --- ### 4. Typical Applications This specific size and thermal profile are commonly found in: 1. **Networking Hardware:** Routers, switches, and small servers. 2. **Industrial PCs:** Controllers that require passive or semi-passive cooling. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators.