The **ATS-16F-47-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for high-performance cooling in space-constrained environments. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 6.43° C/W @ 200 LFM | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W)** | 36.83mm x 36.83mm | | **Height** | 22.86mm | | **Fin Style** | XC (Extra Coarse) / Flared | --- ### 2. Key Components & Features #### A. Fin Design (maxiFLOW™) The "XC" in the design indicates a flared fin structure. Unlike standard straight-fin heat sinks, these fins spread outward. This geometry increases the surface area for heat dissipation and maximizes air intake, making it ideal for systems with high-pressure airflow. #### B. pushPIN™ Attachment The part uses the ATS **pushPIN™** system for mounting. This is a critical electronic hardware feature that includes: * **Brass/Plastic Pins:** Used to secure the sink to the PCB. * **Compression Springs:** Provides precise, uniform pressure on the electronic component (CPU, FPGA, or GPU) to ensure optimal thermal contact. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that it comes with a pre-applied high-performance thermal interface material (like a thermal pad or paste). This fills the microscopic air gaps between the component and the heat sink base. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **16** | Series designation | | **F** | Attachment Type (pushPIN™) | | **47** | Specific physical footprint/dimensions | | **C3** | Material/Finish (Blue Anodized Aluminum) | | **R0** | Packaging/Revision (Standard pre-applied TIM) | --- ### 4. Common Applications This part is commonly found in the following electronic sectors: 1. **Telecommunications:** Cooling of networking switches and routers. 2. **Embedded Systems:** High-heat processors on industrial motherboards. 3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs).