The **ATS-16F-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Model: ATS-16F-49-C2-R0 | | **Base Material** | Aluminum | Blue Anodized finish | | **Fin Type** | Fine Pitch (Straight) | Optimized for airflow | | **Attachment** | Push Pin | Integrated brass springs | | **Dimensions** | 25mm x 25mm | Height: 20mm | | **Thermal Resistance** | 5.41°C/W (at 200 LFM) | Lower is better for cooling | | **Interface Material** | T766 | Pre-applied Thermal Phase Change | --- ### 2. Key Features and Components ### A. Material and Coating * **Aluminum Construction:** Offers a lightweight and cost-effective solution with excellent thermal conductivity. * **Blue Anodized Finish:** Not only provides aesthetic appeal but also increases surface emissivity for better radiation cooling and protects the aluminum from corrosion. ### B. Attachment Mechanism (Push Pin) The "R0" designation indicates a specific push-pin attachment style. * **Spring-loaded Pins:** These ensure constant, uniform pressure on the electronic chip, which is critical for maintaining effective thermal contact. * **Ease of Assembly:** It allows for quick installation on PCBs (Printed Circuit Boards) with pre-drilled holes. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material that softens when the component heats up, filling microscopic air gaps between the heat sink and the chip to maximize heat transfer efficiency. --- ### 3. Application Use Cases This specific heat sink is typically used in environments where space is limited but high cooling efficiency is required: 1. **Telecommunications:** Cooling of high-speed processors in routers or switches. 2. **Power Supplies:** Managing heat in voltage regulators. 3. **Embedded Systems:** Industrial PCs and IoT gateways where active cooling (fans) might be minimal. ---